Die Size
|
Wafer Size
|
9.6*10.26 mm² |
8 inch
|
Features:
⚫Trench FS Technology
⚫Low Eoff
⚫10µs Short Circuit Capability
⚫Square RBSOA
⚫Positive Vce(sat) Temperature Coefficient
Applications:
⚫Welding Machine/ Cutting Machine
⚫Induction Heating/HF Power
*Download datasheet 
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