Packaging	Circuit Diagram
TO247-3L

Features：                                                                          

⚫High Frequency Operation

⚫Low Forward Voltage Drop                                                                                                                                     

⚫High Purity, High Temperature Epoxy Encapsulation for Enhanced Mechanical Strength and Moisture Resistance

⚫Guard Ring for Enhanced Ruggedness and Long Term Reliability

⚫Solder Dip 275 °C Max. 7 s, Per JESD 22-B106 

Applications：

⚫Switch Power Supplies

⚫Converters

⚫Freewheeling Diodes

⚫Reverse Battery Protection

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