Packaging	Circuit Diagram
M1

Features：                                                                          

⚫Low Switching Losses                                                                               

⚫Low Inductive Design≤6.6nH                                                                               

⚫Low Qg and Crss

⚫High Performance Si3N4 Ceramic

⚫Direct Cooled PinFin Base Plate

⚫Low Inductive Design<10nH

⚫Hight Tg EMC Transfer Molding

⚫Copper wire bonding

⚫Ag sintering

Applications：

⚫Automotive Applications

⚫Hybrid Electrical Vehicles (H)EV

⚫Motor Drive

⚫Commercial Agriculture Vehicles

*Download datasheet

*Contact us: