Die Size
|
Wafer Size
|
12.40*12.40 mm² |
6 inch
|
Features:
⚫Non Punch Through (NPT) Technology
⚫Low Vce(sat)
⚫10µs Short Circuit Capability
⚫Square RBSOA
⚫Positive Vce(sat) Temperature Coefficient
Applications:
⚫Welding Machine/ Cutting Machine
⚫Induction Heating
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