Die Size
|
Wafer Size
|
6.60*8.80 mm² |
6 inch
|
Features:
⚫Non Punch Through (NPT) Technology
⚫Low Vce(sat)
⚫10µs Short Circuit Capability
⚫Square RBSOA
⚫Positive Vce(sat) Temperature Coefficient
Applications:
⚫Welding Machine/ Cutting Machine
*Download datasheet 
*Contact us: