Packaging	Circuit Diagram
DIP26

Features：                                                                          

⚫IMS Insulated Heat Dissipation Substrate                                                                                                                                   

⚫DIP (dual in-line package) Fully Insulated Package Structure

⚫Three-phase Full Bridge 15A/600V

⚫Compatible With TTL/CMOS Level

⚫Built-in Bootstrap Circuit

⚫Independent Full Bridge Overcurrent Protection

⚫Built-in Upper and Lower Bridge 6-channel Undervoltage Protection

⚫Built-in Upper and Lower Bridge Interlocking Function

⚫FLT Fault Signal Output

⚫Lower Bridge IGBT Emitter is Independently led Out

⚫Insulation Withstand Voltage 2000VRMS

Applications：

⚫Consumer Electronics Motor Drive

⚫Low Power Industrial Motor Drive

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