Power electronics have come a long way, and IGBT packaging has been at the heart of this revolution. From early wire-bonded designs to today’s advanced silicon carbide (SiC) modules, packaging innovations have made IGBTs smaller, stronger, and more efficient.

But first—what is IGBT? An Insulated Gate Bipolar Transistor (that’s what IGBT stands for) is a key component in high-power applications like EVs and solar inverters. Its performance depends heavily on IGBT packaging, which has seen major breakthroughs in recent years.

In this article, we’ll explore:

The evolution of IGBT package types

Why wire bonds are being replaced

How silicon carbide is changing the game

 

What Is IGBT Packaging?

IGBT packaging refers to how the semiconductor is enclosed and connected. It protects the chip, manages heat, and ensures electrical performance.

Key parts of IGBT packaging:

Chip (Die) – The actual IGBT semiconductor

Substrate – Connects the chip to the circuit

Encapsulation – Shields against moisture and dust

Cooling System – Prevents overheating

Different IGBT package types serve different needs—some prioritize power handling, others focus on compact size.

 

The Era of Wire-Bonded IGBT Packaging

For decades, wire bonding was the standard. Thin gold or aluminum wires connected the IGBT chip to the package leads.

Pros:

✅ Low cost

✅ Simple manufacturing

Cons:

❌ Weak under thermal stress (wires can break)

❌ Limits power density

❌ Higher electrical resistance

Wire bonds worked for early applications, but modern power systems needed something better.

 

Modern IGBT Packaging Breakthroughs

1. Press-Pack Modules

Instead of wires, press-pack IGBTs use direct metal contacts. Benefits:

Handles higher currents

Better heat dissipation

Longer lifespan

Used in:

High-voltage power transmission  Learn more details 

Industrial motor drives   Learn more details 

 

2. Silver Sintering

Replaces solder with silver paste for stronger, heat-resistant bonds.

5x better thermal conductivity

Reduces failure rates

 

3. Silicon Carbide (SiC) IGBTs

SiC is the biggest leap in IGBT packaging. Advantages:

Higher temperature tolerance

Faster switching speeds

Lower energy losses

SiC IGBTs are ideal for:

Electric vehicles  Learn more details

Renewable energy systems  Learn more details 

 

Comparing IGBT Package Types

Packaging Type	Best For	Limitations
Wire-Bonded	Low-cost applications	Poor heat handling
Press-Pack	High-power systems	Expensive
SiC-Based	High-frequency, high-temp uses	Higher cost

 
  
Future of IGBT Packaging

3D Packaging – Stacks chips vertically for compact designs.

Liquid Cooling – For ultra-high-power applications.

Self-Healing Materials – Repairs minor cracks automatically.

 

FAQ: Quick IGBT Basics

1. What does IGBT stand for?

Insulated Gate Bipolar Transistor—a hybrid of MOSFET and BJT transistors.

 

2. What is IGBT’s main advantage?

Efficient high-power switching with low losses.

 

3. Which IGBT package type is best for EVs?

Silicon carbide (SiC) modules—they handle heat and power best.

 

Conclusion

IGBT packaging has evolved dramatically—from fragile wire bonds to rugged SiC modules. Each breakthrough improves efficiency, power density, and reliability.

Now you know:

✔ What IGBT stands for and why packaging matters

✔ The pros and cons of different IGBT package types

✔ How silicon carbide is shaping the future

The next time you see an EV or solar inverter, remember—the real magic is in the packaging.

 

(SHY Semi's IGBT Modules Production Process)

Video Source: Shenhuaying Semiconductor